A BGA/SMT Rework Station for XL PCBs

  • Gantry Mounted Advanced Focused IR component heating
  • Large Quartz IR PCB preheating with 3 zones
  • 24”/620mm PCB Capacity
  • Split Beam prism system for simultaneous PCB/component viewing
  • Precision Components Pick and Placement up to 10um
  • Precision PCB handling
  • Component Nest/Flux Application Facility
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Reflow Process Observation Camera
  • PCB Forced Air Cooling

To learn more about the IR-E6 Evolution and its highlights, simply download our datasheet below.

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Top heat power 150W IR
Back heater power 3200W, 2 Zone, 2 x 16700W
Voltage/frequency 208-240 volts 50/60Hz, up to 3KW
Typical components CSPs, BGAs, uBGAs, QFNs, QFPs, PLCCs, SOICs, small SMDs
Bench area 2000mm (w) x 1000mm (d)
Weight 100 Kg