OmniMax 10

The Electrovert OmniMax 10 Zone Reflow Soldering System is designed to deliver maximum thermal performance combined with process capability and control. The OmniMax platform offers a combination of industry proven technologies in an easy to use, reliable and efficient reflow system for high-end production requirements. From lead-free to hybrid processing, the Electrovert OmniMax 10 zone oven delivers high performance thermal processing. The Electrovert OmniMax sets the standard in innovative technologies that save on lowest power and nitrogen consumption rates.

Proven Performance, World Class Results
Patented IsoThermal™ chamber technology is what differentiates Electrovert ovens from others. In a reflow oven, the consistent thermal capability and control within the heated length is what matters most rather than the number of zones. The OmniMax 10 uses a dual IsoThermal approach that produces ΔT’s less than ±2°C. On thermally challenging heavily populated PCBs, the OmniMax outperformed competitive 10, 11, and 12 zone ovens in thermal capability, thermal uniformity, and energy consumption.

Proven Performance, World Class Results
Patented IsoThermal™ chamber technology is what differentiates Electrovert ovens from others. In a reflow oven, the consistent thermal capability and control within the heated length is what matters most rather than the number of zones. The OmniMax 10 uses a dual IsoThermal approach that produces ΔT’s less than ±2°C. On thermally challenging heavily populated PCBs, the OmniMax outperformed competitive 10, 11, and 12 zone ovens in thermal capability, thermal uniformity, and energy consumption.

Innovative Cooling
The patented cooling module in OmniMax/ES series is designed to provide process flexibility, to meet the cooling slope requirements on thermally challenging board assemblies, and to reduce the opportunity for flux dripping in the process area. The air flow dynamics within the cooling zones are efficiently controlled for a balanced environment that can reduce nitrogen consumption up to 20-25%. The design includes a patented dripless cooling which significantly reduces the potential for flux dripping in the cooling area. The excellent separation between the heating and cooling area produces a tight control of time-above-liquidus.