A simple rework station for all BGA/SMT components

  • Advanced Focused IR component heating
  • Quartz IR PCB preheating with up to 3 zones
  • Split Beam prism system for simultaneous PCB/component viewing
  • Precision Components Pick and Placement up to 10um
  • Precision PCB handling
  • Component Nest/Flux Application Facility
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Reflow Process Observation Camera
  • PCB Forced Air Cooling

To learn more about the IR-E3 Evolution and its highlights, simply download our datasheet below.

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Top heat power 150W IR
Back heater power 2250-3050W IR
Voltage/frequency 208-240 volts 50/60Hz, up to 3KW
Typical components SMD, BGA, uBGA, QFN, LED, uLED, 0201 etc.
Bench area 1400mm (w) x 600mm (d)
Weight 65 Kg