An Entry-Level SMD/BGA Rework Station

  • Advanced Focused IR component heating
  • Quartz IR PCB preheating
  • Bench Mounted Workholder
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Handheld Suction Wand

To learn more about the IR-C3 Chipmate and its highlights, simply download our datasheet below.

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Top Heat Power 150W IR
Back Heater Power 2000W IR
Voltage/Frequency 110-240 volts 50/60Hz
Typical Components CSPs, BGAs, uBGAs, QFNs, QFPs, PLCCs, SOICs, small SMDs
Bench Area 1200mm (w) x 600mm (d)
Weight 45 Kg