The Momentum® II 100 stencil printer is a hard-working, value-priced machine utilizing the robust, reliable Momentum series printer proven in top facilities around the world. Featuring a modest footprint that can grow with the user: add or retrofit innovative, patented features as throughput demands grow.

Proven Momentum II Series Accuracy and Performance
Wet Print accuracy of 20µm@6σ, Cpk ≥ 2, with 6σ capability designed in and independently verified. The Momentum II series stencil printers are fast, precise, and highly reliable, with performance unmatched by any other printer in their class.

More Throughput in Less Space
The Momentum II 100 is a space-saving 200 mm shorter than the standard Momentum II stencil printer platform. Configured for Back-to-Back (BTB) processing, for example, two individual printers back to back in a manufacturing line enables dual-lane processing with the combined output of two machines, but in the line length of one.

Total Front-Side Access
The Momentum II 100 is designed for total front-side accessibility for simplified service to the electrical system, access to the solvent reservoir, and more. Without the need for rear access space, adjacent BTB machines help you make the most of every inch of your floor space.

Faster ROI and Low Cost of Ownership
Accurate and repeatable performance delivers quality products with fewer defects. The reasonable cost of ownership for the Momentum II 100 printer ensures you'll see a faster ROI, and higher profitability going forward.

Benchmark™ User Interface
Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

To learn more about the Momentum II 100 and its highlights, simply download our datasheet below.

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Our sales and technical team are on hand to support any questions you may have.

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Maximum Board Size (X x Y) 609.6 mm x 508 mm (24” x 20”) A dedicated workholder is required for boards with an X size greater than 20”
Minimum Board Size (X x Y) 50.8 mm x 50.8 mm (2” x 2”)
Maximum Board Weight 4.5 kg (10 lbs)
Maximum Print Area (X x Y) 609.6 mm x 508 mm (24” x 20")
Print Speed 0.635 mm/s - 304.8 mm/s (0.025 in/s - 12 in/s)
Print Force 0 to 22.7 kg (0 lb to 50 lbs)

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AccuCheck Printer Capability Verification

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Adjustable Stencil Shelf

Provides the flexibility to handle all stencil sizes with a simple adjustment of the shelf. The robust design provides better stability on all stencil sizes.

Automatic Paste Dispenser

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

BridgeVision and StencilVision System

BridgeVision is a patented method of analyzing bridge defects on circuit boards in the post-print inspection process. This innovative system utilizes texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects. StencilVision utilizes texturebased technology to check the underside of a stencil for solder paste contamination. Wiper operation can be driven by the results obtained.
MPM Vision System & Inspection

MPM’s patented printer based Vision and Inspection system is a cost-effectiveway to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

OpenApps Architecture

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.
Paste Height Monitor

The Paste Height Monitor is designed to prevent defects caused by inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.
Paste Temperature Monitor

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent-pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.
Quick Release Squeegee

New quick release squeegee blades makes changing blades quick and easy with no tools required. It takes less than 30 seconds to change the blade.
RapidClean Stencil Cleaner

RapidClean is a high-speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance. RapidClean can save up to $10K USD per nnum in paper savings per printer.
SPI Print Optimizer

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.