With industry leading accuracy and repeatability (certified by third party), the ITW EAE Momentum II BTB stencil printer gives users greater flexibility for line configuration. Use the superior print performance of the Momentum II BTB stencil printer for dual-lane output overall smaller footprint.
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ITW EAE | MPM Stencil Printer
Momentum II BTB
Higher Productivity from an Optimised Footprint
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Elevate your production with ITW EAE MPM stencil printers.
More Throughput in Less Space
The Momentum II BTB printer is a space-saving 200 mm shorter than the standard Momentum II printer. Configure for dual-lane processing by positioning two BTB printers back-to-back in a manufacturing line. Dual-lane processing generates the output of two printers in the length of one.
Ultimate Flexibility in the Momentum Platform
Use the MPM printer in-line as a stand-alone or configure back-to-back for dual-lane output. Print multiple products in a single SMT line, for example, print top and bottom sides, print the same side, or print mother/daughter boards. The Momentum II BTB printer comes in two different throughput configurations for optimum flexibility in line balancing.
Match Printer Strategy to Dual Lane Strategy
The Momentum II BTB printer allows total front-side accessibility and service, with open access to the electrical system, solvent reservoir, and other key components. Because the BTB printer requires no read access or extra buffer space, position each printer to maximize your facility floor space.
Proven Momentum Series Accuracy and Performance
Alignment repeatability of ±11 microns @ 6 sigma, Cpk ≥2 and wet Print accuracy of 17µm@6σ, Cpk ≥ 2, with 6σ capability designed in and independently verified. The MPM Momentum II series printers are fast, precise, and highly reliable, with performance unmatched by any other printer in their class.
Benchmark User Interface
Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.
AccuCheck Print Capability Verification
AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.
Adjustable Stencil Shelf
Provides the flexibility to handle all stencil sizes with a simple adjustment of the shelf. The robust design provides better stability on all stencil sizes.
Automatic Paste Dispensing System
Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.
BridgeVision and StencilVision System
BridgeVision is a patented method of analyzing bridge defects on circuit boards in the post-print inspection process. This innovative system utilizes texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.
StencilVision utilizes texturebased technology to check the underside of a stencil for solder paste contamination. Wiper operation can be driven by the results obtained.
EdgeLoc Board Clamping System
The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.
EnclosedFlow Print Head
The EnclosedFlow print head offers significant process and cost advantages over printing with metal squeegee blades, particularly for fine-feature printing. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.
The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine pitch features such as 01005s and 0.3 mm pitch CSPs with up to 50% greater volume and 25% lower deviation that squeegee blades. The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.
High Flow Venturi with Closed-loop
The High Flow Venturi System with closed-loop control represents a major advancement, blending digital programmability with exceptional flexibility and simplicity in setup. Its precise programmability, adaptability to different substrate thicknesses, and focus on maintaining quality consistency make it an invaluable asset for boosting productivity and yield.
The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine pitch features such as 01005s and 0.3 mm pitch CSPs with up to 50% greater volume and 25% lower deviation that squeegee blades. The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.
OpenApps Architecture
MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.
Paste Height Monitor
The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.
Paste Temperature Monitor
Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.
PrinTrack
The PrinTrack feature adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easy access to a comprehensive history, detailing:
- How your product was printed
- When it was printed
- The process parameters used to print the board
- All pertinent information that can be used to track products or troubleshoot the process if needed.
A flexible web reporting interface can be user-configured to produce traceability reports.
Quick Release Squeegee
New quick release squeegee blades make changing blades quick and easy with no tools required. It takes less than 30 seconds to change the blade.
RapidClean Stencil Cleaner
The RapidClean stencil cleaner is a high-speed stencil cleaning solution that improves cleaning performance and cuts cycle time. The RapidClean stencil cleaner provides precise wet/dry wipe transition and exceptional cleaning results with its paper over plenum design, venture vacuum, and patented roller solvent bar delivery system.
SPI Print Optimizer
The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration ‘on the fly’ to stay on target and prevent print defects.
MPM Vision System & Inspection
MPM’s patented printer based Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.
The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine pitch features such as 01005s and 0.3 mm pitch CSPs with up to 50% greater volume and 25% lower deviation that squeegee blades. The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.
| MPM Momentum II BTB | |
| Maximum Board Size (X x Y) | 609.6 mm x 508 mm (24” x 20”) |
| Minimum Board Size (X x Y) | 50.8 mm x 50.8 mm (2” x 2”) |
| Board Thickness | 0.2 mm to 5.0 mm (0.008” to 0.20”) |
| Maximum Board Weight | 4.5 kg (10 lbs) |
| Board Edge Clearance | 3.0 mm (0.118") |
| Underside Clearance | 12.7 mm (0.5") standard. Configurable for 25.4 mm (1.0”) |
| Board Hold-Down | Fixed top clamps, centernest vacuum |
| Board Support Methods | Magnetic pins Optional: Vacuum side dams, vacuum pins, support blocks, dedicated fixtures, patented auto tooling, Quik-Tool |
A tradition of innovating solutions for electronics manufacturing.
ITW EAE is a division of the Illinois Tools Works, Inc., a Fortune 200 global industrial manufacturer with operations in 58 countries.
ITW EAE is a developer and provider of capital equipment used in electronics manufacturing, and is found in premier printed circuit board (PCB) assembly facilities the world over. ITW EAE comprised with industry-leading brands: MPM stencil printing equipment for electronic materials; Camalot Systems fluid dispensers; Electrovert wave soldering, and curing, and cleaning equipment; and Despatch industrial oven and furnaces.
