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PDR Rework E3 IR Rework station for all BGA-SMT components

PDR Rework | IR BGA Rework Station

IR-E3

IR Rework station for all BGA/SMT components

The PDR IR-E3 SMD/BGA Rework Station is a compact yet powerful solution for precision soldering and de-soldering of small to medium-sized printed circuit boards (PCBs). Featuring advanced infrared heating technology, the IR-E3 is designed to deliver precise thermal control, making it ideal for reworking Surface Mount Devices (SMDs) and Ball Grid Array (BGA) components.

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The PDR IR-E3 SMD/BGA Rework Station is a compact yet powerful solution for precision soldering and de-soldering of small to medium-sized printed circuit boards (PCBs). Featuring advanced infrared heating technology, the IR-E3 is designed to deliver precise thermal control, making it ideal for reworking Surface Mount Devices (SMDs) and Ball Grid Array (BGA) components.

With its intuitive interface and real-time temperature monitoring, the IR-E3 ensures accurate and repeatable rework processes, significantly reducing the risk of thermal damage to sensitive components. This versatile system is perfect for a wide range of PCB repair tasks, from high-density boards to intricate assemblies, providing reliability in both production and repair environments.

The PDR IR-E3’s compact design is ideal for operators looking to save space without sacrificing performance. Easy to set up and operate, this system integrates seamlessly into electronics manufacturing or repair workflows, offering efficient and high-quality rework results for a variety of applications.

Whether you’re addressing complex repairs or routine maintenance, the IR-E3 delivers professional-grade performance, making it an essential tool for electronics manufacturers and repair specialists alike.

IR Rework station for all BGA/SMT components.

Features

  • Advanced Focused IR component heating
  • Quartz IR PCB preheating with up to 3 zones
  • Split Beam prism system for simultaneous PCB/component viewing
  • Precision Components Pick and Placement up to 10um
  • Precision PCB handling
  • Component Nest/Flux Application Facility
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Reflow Process Observation Camera
  • PCB Forced Air Cooling

Bench Area: 1400mm (w) x 600mm (d)
Weight: 65kg
Warranty: 2 years
Voltage Frequency: 208-240 volts 50/60Hz, up to 3.5KW
Top Heater Power: 150W Focused Infrared up to Ø70mm Spot
PCB Preheater Power: 3250W Dark IR
PCB Preheater Heating Area Size: 14.1 x 9.4”/360 x 240mm
Number of PCB Preheater Zones: 3 Zones
Spot Size Included: F700 (Ø 25-70mm), F200 (Ø 10-28mm)
Component Placement: Split Beam Prism Alignment/x50 Magnification
Placement Accuracy: Up to 10um
Component Temperature Sensing: Non-Contact IR Sensor
PCB Temperature Sensing: Non-Contact IR Sensor
Max PCB Size: 12 x 18”/300 x 450mm
Max Component Size: 2.1 x 2.1”/55 x 55mm
Min Component Size: 01005
Reworkable Area: 10 x 15.9”/254 x 406mm
Number of TC Channels: 4
Operating Software: PDR’s Thermoactive Software Suite suitable for Windows 10+

PDR Lens Attachments
AC-F150 F150 (Ø4 – 18mm spot size)
AC-F400 F400 (Ø12 – 35mm spot size)

PDR Micro Component Kit
UGMC01 PDR Micro Component Kit (F150 lens attachment, low profile pickup head, SP03031:SP03030:SP03049 pick-up tips)

Spares Kits
AC02009 Consumables kit (lamp+socket, gel flux, roll 25mm black tape, vac cup, springs, O rings)
AC02008 Consumables kit (lamp+socket, gel flux x 2, roll 25mm black tape, vac cup, springs, O rings, Lens No1, Cold Mirror)

Solderpaste Print Part System
PDRPP01 Print Part System
PDRPP02 Print Part System Additional Stencil

PDR Reball Kit
PDRRB01 PDR BGA Reball Set (BGA foil & frame, paste foil & frame, hi-temp esd nest, squeegee blade)
PDRB02 PDR BGA Reball Additional Component Set

Other
SP05029 Laser Alignment Tool
SC020 Controller & Sensor Calibration Check Kit
SP05017 PCB Sensor Contact Probe
SP06008 Additional Board Support Asssembly

The benchmark for soldering and desoldering quality.

PDR Rework

PDR Rework Systems offer a comprehensive range of equipment specifically engineered for effective PCB rework, including advanced soldering tools, desoldering systems, and inspection equipment. With a focus on innovation, PDR’s products are designed to handle a variety of rework applications, from simple component replacement to complex BGA (Ball Grid Array) repair.

The PDR rework systems are equipped with state-of-the-art technology that ensures precise temperature control, allowing for optimal soldering and desoldering processes without damaging sensitive components. This capability is crucial in today’s fast-paced manufacturing environment, where efficiency and quality are paramount.

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