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ECD OvenSENTINEL

ECD | Continuous Monitoring

OvenSENTINEL

Real-time, ongoing monitoring of reflow soldering equipment.

OvenSENTINEL, the latest continuous monitoring solution from ECD, sets the new standard in reflow process monitoring and product traceability. OvenSENTINEL leapfrogs competitor product to deliver unmatched measurement and visibility – down to the board and profile specification level – isolating and analyzing potentially damaging process variations. Completely customizable with user-specified dashboards, expanded sensor inputs, and flexible data extractions. OvenSENTINEL allows detailed and actionable reflow process oversight.

Is this system right for you?

Let our expert team guide you in choosing the perfect system for your needs.

Features

Dynamic Measurement Capabilities

  • Flexible data extraction that goes beyond standard metrics
  • Open architecture that is integration-ready for future measurement needs
  • Unique design allowing extended sensor types and measures along with density with location profile technology

Continuous quality monitoring

  • Precise PASS / FAIL for every board
  • Intuitive interface supports multiple lanes, ovens, and factories
  • Responsive and programmable event actions and notifications

Industry 4.0

  • Industry accepted SQL database with mirroring, aggregation built in
  • Easy integration and full featured reporting delivers actionable data and deep analytics.

Automated Thermal Profiling
Auto start /arm/profile generation/product change over

Full-featured Traceability

  • Local and remote database support
  • Dynamic and full featured traceability record.
  • Extended sensor inputs allows for monitoring of additional needed measures like O2

Ovensentinel Software

  • Continuous oven monitoring
  • Process Data Archiving and Playback
  • Automatic Statistical Process Control Charting
  • Out-of-Specification Alarm
  • Trusted traceability with patented TrueProfile™ technology

Delivering quality, reliability, traceability, and profitability.

Specifications

Sensors

  •  Zone Thermal Probe✹ (Custom per oven make & model)
  • Optical Board Entry and Exit
  • Inductive Conveyor Speed

Type K: Special Limits of error ±1.1 or ±0.004*T per ASTM E230/E230M-12, IEC 60584:2013 and ISA–MC96.1–1982.

Maximum Probe Temperature

  • Flexible Probe: 350°C (662°F)
  • Solid Probe: 350°C (662°F)

Display/ Notification

Status Badge / Light Tower (Optional)

  • Green: System In Spec
  • Yellow: System Warning
  • Red: Out-of-Spec Indicator

Physical

Station (W x H x D): 266.7mm (10.5”) x 241.3mm (9.5”) x 47.6mm (1.88”)

Station Inputs (59 Total)

Thermocouple (24)

  • Type K, ± 1.5°C (2.7°F)

Digital (7)

  • Boolean: True/False (1/0)
  • Frequency: 10-1,000Hz ± 1 Hz
  • Period: 0-10 Seconds ± 1 Millisecond

RS-485 (1)

  • MODBUS Protocol

RS-232 (2)

  • ASCII

Software Requirements

  • Microsoft Windows 7 or higher
  • OvenSENTINEL Software: MS SQL (Included)

Standard Kit description

  • OvenSENTINEL Station
  • Status Badge – Green, Yellow & Red
  • Oven Zone Thermal Probe (custom per specific oven model)
  • Installation Kit for your brand of Oven
  • Board In & Conveyor Speed Sensors
  • OvenSENTINEL Software
  • Users Operation Guide

System Options

  • Board Dropped – Monitor Single & Dual Lane
  • Missing Bar Code – Monitor Single & Dual Lane
  • SMEMA Interface – Monitor Single and Dual Lane
  • Power Monitoring – Monitor Single & Dual Lane
  • Light Tower – Red, Green & Yellow w/Alarm

Deliver accurate and reliable thermal data.

ecd thermal profiling technology logo

ECD Thermal Profilers are engineered to deliver accurate and reliable thermal data, essential for optimising manufacturing processes. With a focus on precision and efficiency, ECD’s profilers help manufacturers achieve the ideal thermal profiles for their products, ensuring consistent quality and performance.

Their cutting-edge technology allows for detailed analysis of thermal cycles, enabling manufacturers to identify potential issues before they affect production. ECD’s thermal profiling solutions are utilised in various applications, including PCB assembly, where maintaining precise temperature control is crucial to achieving optimal soldering results.

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