3D SPI
The VP9000 uses highly accurate and repeatable 3D imaging to perform complete PCB solder paste analysis.
OMRON’s 3D SPI systems deliver advanced solder paste inspection to guarantee the accuracy and consistency of paste deposits, a critical step in achieving defect-free PCB assemblies.
Utilising high-resolution 3D imaging and advanced algorithms, these systems accurately measure volume, height, area, and shape of solder deposits, ensuring the optimal performance of each board.
Designed to integrate seamlessly into modern production lines, OMRON’s 3D SPI systems provide real-time monitoring and detailed feedback, allowing manufacturers to quickly address deviations and improve overall process control. By identifying issues such as insufficient paste, bridging, or misaligned deposits early in the process, the risk of downstream defects is greatly reduced.
Whether you’re working in a high-mix, low-volume environment or a large-scale operation, OMRON’s 3D SPI solutions offer the flexibility, speed, and precision needed to maintain strict quality standards. Supported by Etek Europe’s dedicated team, our expert service and continuous support help ensure your inspection processes run smoothly and efficiently, enhancing production outcomes while minimising costly errors.
