VT-X750 is designed with the philosophy to achieve Zero Defect process lines. Traditional X-ray technologies are limited to inspect components like BGAs, LGAs or THT. VT-X750’s design overcomes these traditional shortfalls by incorporating high speed ‘Computed Tomography’ (CT), providing high-precision X-ray imaging to perform precise and reliable inspection of those hidden soldered areas during production. Combining Computed Tomography with High-Speed image capture and processing, VT-X750 delivers the highest-level inspection capability, targeting the High-Quality Manufacturing Market. VT-X750 high capability will inspect accurately and reliably, soldered defects such as Head in Pillow and Voids within BGA, LGA, THT and other discrete devices.