The Temperature control unit (TCU) has been designed to meet a very specific process requirement within the electronics sector. The reliable placement of surface mount devices during PCB assembly requires that during the initial printing stage, the solder paste is maintained at a temperature which helps to keep optimum performance.
With assembly now on a global basis, the variation of local climate and factory conditions means that this optimum level cannot be maintained without some form of intervention.
The design of the TCU includes cooling and heating elements which help to maintain the temperature within the printing environment within 1°C of the optimum paste performance temperature regardless of whether the factory ambient is above or below this level.
