The OMRON VP-01G, is High Value cutting-edge solution designed to minimise waste in PCB production while advancing towards smaller and higher density components. This state-of-the-art system enhances inspection efficiency through innovative 3D image processing and industry-leading high-speed inspection capabilities. The VP-01G’s distinctive Smart SMT Style not only analyses but also optimizes printing conditions, offering the highest value to effectively prevent printing defects for a seamless production process.
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OMRON | 3D-SPI System
VP-01G
3D-SPI Automated Solder Paste Inspection.
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Description
The VP-01G, is High Value cutting-edge solution designed to minimize waste in PCB production while advancing towards smaller and higher density components. This state-of-the-art system enhances inspection efficiency through innovative 3D image processing and industry-leading high-speed inspection capabilities. The VP-01G’s distinctive Smart SMT Style not only analyses but also optimizes printing conditions, offering the highest value to effectively prevent printing defects for a seamless production process.
Our team of specialists offer knowledge and expertise in your imaging process.
Features
- High-Speed 100% 3D Solder Paste Inspection
- Highly Accurate Solder Paste Volume Measurement (within 2%)
- Multiple Resolution Setting with 3-Mode Zoom Function (down to 5µm)
- User-Friendly Software with Integrated, Graphical Use Interface
- Simple Program Creation from GERBER and or Mount Data (compatible with ePM)
- Complete Offline Program Generation without Interrupting Production.
- Active Warp compensation
- Glue and Foreign Material Inspection.
- Closed-loop with printer and feed-forward with Placement systems.
- Unique Connection to: Omron Q-upNavi: Combine Omron SPI, AOI and AXI
- Result Data Together for True Root-Cause Analysis.
- Unique Connection to: Omron Q-upOpti: Skill-less SPI Setting and
- Optimisation calculated from AOI Solder Values.
- Unique Connection to: Omron Q-upAuto-I: Production Quality Analysis across your Entire Production Line.
Specifications
| Basic Specification | Dimensions (W x D x H) | 938 x 1,191 x 1,480mm |
| Conveyer Height | 900 ±20mm | |
| PCB Size | 50 x 50 - 510 x 510mm (L size) | |
| Min. PCB Edge Clearance | 4 mm | |
| PCB Clearance (Top/Bottom) | Top 5mm, Bottom 30mm | |
| PCB Thickness | 0.3 - 5.0mm | |
| PCB Weight | Less than 5kg | |
| Machine Weight | 600kg | |
| Power Supply | Single phase AC200V - 240V ±10% 50/60Hz ±1Hz | |
| Power consumption | Max. 1KVA | |
| Pneumatic Supply | 0.3 - 0.4Mpa (4kgf/cm2) | |
| VP lnspection Technology | Camera | CMOS Mono Camera -Global shutter spec |
| lnspection Principle | Phase Shift + Hybrid lnspection - 2D Ring light and 3D Projector(s) | |
| lnspection ltem | Volume, Projection, Dimness, Area, Shift, Average Height, Bridging, lnspection ltem No Solder, Coplanarity, Foreign Material, Glue (Option) |
|
| Mechanical Technology | Clamping Method | Side, Top and Bottom Simultaneous Clamping |
| PCB Stop | Sensor Control System (No Stopper) | |
| PCB Load/Transfer | Double Side PCB Loading/Transfer System | |
| PCB Warpage | ±5mm (Original Mechanical Adjustment System) |
| Performance | lnspection Resolution (Multiple Resolution Switch Function) | 25/12.5/8.5μm | 20/10/?μm | 15/7.5/5μm | 10/5μm |
|---|---|---|---|---|---|
| Solder Paste Height (Standard) | Less than 400μm | Less than 300μm | Less than 300μm | Less than 150μm | |
| Solder Paste Height (Option) | Less than 600μm | Less than 450μm | Less than 450μm | Less than 225μm | |
| Max. lnspection Speed | 9400mm2/sec | 6000mm2/sec | 3300mm2/sec | 1400mm2/sec | |
| FOV Size | 50x50mm | 40x40mm | 30x30mm | 20x20mm | |
| Min. Solder Paste Pitch | 50μm (Stencil thickness: 100um) | ||||
| Height Resolution | 1μm | ||||
| Accuracy (3o) | Within 2% (Dual Projection)/Within 3% (Single Projection) | ||||
| GR & R | Within 10% | ||||
| Software | Inspection Program | CKD VPDS Programing System (Program Creation Time Min. 3 mins) ePM Programing Software (Option) |
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| SPC | CKD Realdata Software System (Real Time Histogram, X bar & R Chart, CP/CPK Chart, Real Time SPC, SPC Alarm, SPC Report) |
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| Optional | Closed Loop | ||||
| ePM | |||||
| Auto Program Launch | |||||
| Area Standard Jig | |||||
| Height Standard Jig | |||||
| ITAC | |||||
| Q-up Opti | |||||
| Dual Projection | |||||
Absolute precision with OMRON's cutting-edge inspection systems.
OMRON Inspection Systems are industry-leading solutions designed to ensure the highest standards of quality and precision in electronics manufacturing. Their systems include Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), and Automated X-ray Inspection (AXI), utilising cutting-edge image processing and machine learning algorithms to detect defects and inconsistencies with exceptional accuracy.
Designed for modern production lines, OMRON’s inspection systems are capable of identifying a wide range of defects, including soldering issues, misaligned components, and surface irregularities. They offer real-time monitoring and feedback, helping manufacturers improve production efficiency and reduce costly errors.
Known for their adaptability, OMRON’s solutions support a variety of production environments, from high-mix, low-volume operations to large-scale manufacturing. With intuitive user interfaces, high-speed inspections, and seamless integration into existing workflows, OMRON Inspection Systems provide manufacturers with the tools required to maintain strict quality control and drive continuous improvement.
