Water-based stencil cleaner for the removal of solder pastes and SMT adhesives
VIGON® SC 200, based on the MPC® Technology (Micro Phase Cleaning), is a water-based cleaning agent designed to clean SMT stencils at room temperature. The cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wipe processes in printers. It is designed for use in spray-in-air and ultrasonic cleaning systems and is also recommended for the cleaning of misprinted solder paste. Depending on the type of flux, VIGON® SC 200 can also be suggested for both double-sided and single-side soldered circuit boards.
Advantages compared to other surfactant cleaners:
Consistently good cleaning results at temperatures between 18-40°C / 64-104°F
High bath loading capability providing extended bath life and reduced cleaning agent costs
Aqueous-based, surfactant-free cleaner; leaves no residues on substrates or inside the equipment
Excellent material compatibility
No flash point and thus, can be used without explosion-proof protection
Non-foaming when used in spray in air and ultrasonic systems
To learn more about the Zestron VIGON® SC 200 and its highlights, simply download our datasheet below.
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