Scalable X-ray inspection system
Cheetah EVO Semi harnesses the combined power of several YXLON innovations - FeinFocus X-ray tube technology, High Power Target technology, a finely calibrated, long-life flat-panel detector, and a manipulator with cushioned bearings. The variety of sample tables ensures that it can generate 2D and 3D images in extremely high resolution.
In addition to imaging excellence, you can look forward to simple, user-friendly controls and YXLON FGUI - FeinFocus Graphical User Interface - software, not to mention the myriad benefits of comprehensive automation. One-click solutions make manual inspections effortless, while Easy Teach-In makes it simple to program the automated procedures that guide the operator swiftly through inspections - and deliver repeatable and reliable results.
Cheetah EVO Semi can be upgraded for CT with the optional microCT module. This enables CT for industrial quality assurance, with in-depth 3D examination of inspection items via virtual cross sections and layers. With its user-friendly YXLON QuickScan® module, it delivers 3D images and virtual slices within a minute.
Optimally configured for Semiconductor back end and Micro Electronics Inspection.
Cheetah EVO Semi harnesses the combined power of several YXLON innovations - FeinFocus X-ray tube technology, long-life flat-panel detector, and a manipulator with cushioned bearings.
3D CT and micro3Dslices ™ can be configured as options
Ultrahigh resolution X-Ray tube
< 300nm (0.3µm) resolution 160kV 15W Target Power Low power Nano-focus mode
High Speed High resolution Flat panel detector
Optional for 3DCT capability & rendering utilising the system PC
To learn more about the Cheetah EVO Semi and its highlights, simply download our datasheet below.
Contact our Imaging specialist
Our sales and technical team are on hand to support any questions you may have.
Swipe for more
|Applications||Benefits for Semiconductors||Software|
|Wafer inspection||Accurate, repeatable void compilations, including multi area voiding||eHDR-Inspect|
|3D integrated circuit joints||Excellent resolution at low power and low kV||User friendly FGUI|
|Microbumps||Fast, automated, easy routines||Multi Area Void Calculation|
|Sensors||Very fast live (on the fly) inspections||Extended ADR|
|MEMS and MOEMS||Extended BGA Inspection|