Advanced 3D X-ray Inspection System
World fastest and best test coverage AXI system for PCB SMT assembly line designed for the automated inspection of PCB assembly to be examined at micron level, with maximum throughput and traceability.
23µm & 11µm or 19µm & 11µm - Std Binning
13µm & 6µm or 11µm & 6µm - 2x2 Binnin
50mm @23µm, 38mm @19µm & 11mm @11µm
Proprietary Hybrid Auto Focus Technology
Automated focus on desired Z-height
Dynamic Range Optimization (DRO)
Assist with heavily shaded components
Virtual Live™ - Micro-sectioning tool through the PCB
3DCT - 3D Recon - configured within auto inspection
To learn more about the V810 S2 EX and its highlights, simply download our datasheet below.
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|Board Dimensions||V810i S2EX||V810i S2||V810i S2 XXL|
|Minimum panel size||482mm X 610mm (19" x 24")||457mm X 610mm (18" x 24")||660mm X 965mm (26" x 38")|
|Minimum panel size||76mm X 76mm (3" x 3")||76mm X 76mm (3" x 3")||76mm X 76mm (3" x 3")|
|Maximum panel inspectable area||474mm X 610mm (18.7" x 24")||434mm X 610mm (17.1" x 24")||654mm X 965mm (25.75" x 38")|
|Maximum panel thickness||7 mm (276 mils)||4mm (160 mils), 7mm (280 mils) with carrier 3.5mm (140 mils) for Dual magnification system||12.7 mm (500 mils)|
|Minimum panel thickness||0.5mm (20 mils)||0.5mm (20 mils)||0.5mm (20 mils)|
|Panel warp||Downside < 3.0mm; Upside < 1.5mm (PSP)||Downside < 2.0mm; Upside < 1.0mm||Downside < 3.3mm; Upside < 3.3mm|
|Maximum panel weight||4.5kg||4.5kg||15kg|
|Minimum panel weight||0.03kg||0.03kg||0.03kg|