Advanced 3D X-ray Inspection System

World fastest and best test coverage AXI system for PCB SMT assembly line designed for the automated inspection of PCB assembly to be examined at micron level, with maximum throughput and traceability.

Variable Magnification
23µm & 11µm or 19µm & 11µm - Std Binning
13µm & 6µm or 11µm & 6µm - 2x2 Binnin

Topside clearance
50mm @23µm, 38mm @19µm & 11mm @11µm

Proprietary Hybrid Auto Focus Technology
Automated focus on desired Z-height

Dynamic Range Optimization (DRO)
Assist with heavily shaded components

Virtual Live™ - Micro-sectioning tool through the PCB
3DCT - 3D Recon - configured within auto inspection

To learn more about the V810 S2 EX and its highlights, simply download our datasheet below.

Contact our Imaging specialist

Our sales and technical team are on hand to support any questions you may have.

Swipe for more

Board Dimensions V810i S2EX V810i S2 V810i S2 XXL
Minimum panel size 482mm X 610mm (19" x 24") 457mm X 610mm (18" x 24") 660mm X 965mm (26" x 38")
Minimum panel size 76mm X 76mm (3" x 3") 76mm X 76mm (3" x 3") 76mm X 76mm (3" x 3")
Maximum panel inspectable area 474mm X 610mm (18.7" x 24") 434mm X 610mm (17.1" x 24") 654mm X 965mm (25.75" x 38")
Maximum panel thickness 7 mm (276 mils) 4mm (160 mils), 7mm (280 mils) with carrier 3.5mm (140 mils) for Dual magnification system 12.7 mm (500 mils)
Minimum panel thickness 0.5mm (20 mils) 0.5mm (20 mils) 0.5mm (20 mils)
Panel warp Downside < 3.0mm; Upside < 1.5mm (PSP) Downside < 2.0mm; Upside < 1.0mm Downside < 3.3mm; Upside < 3.3mm
Maximum panel weight 4.5kg 4.5kg 15kg
Minimum panel weight 0.03kg 0.03kg 0.03kg