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Advanced 3D Solder Paste Inspection System

V310i Advanced 3D Solder Paste Inspection System (SPI) solution.
The V310i Series offers a powerful range of technologies and high throughput productivity & traceability for SMT production lines.

Camera System
4 MPxl digital camera; 18µm/pixel (Opt 10µm/pixel for 01005 inspection)

Field of view
36mm x 36 mm@18µm, 20mm x 20 mm@10µm

Macro lens
PSLM Structured Lighting, 2X Projectors (Optional 3X Projectors)

To learn more about the V310i and its highlights, simply download our datasheet below.

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Board Dimensions V310i
Maximum board size (Single Lane) -
Maximum board size 510 mm by 510 mm (20 inch by 20 inch) with 2 projectors
Minimum board size 50 mm by 50 mm (2 inch by 2 inch)
Maximum board thickness 4 mm (0.16 inch)
Minimum board thickness 0.5 mm (0.02 inch)
Board weight Up to 3kg (6.6lb)
Maximum inspected area 503 mm by 510 mm (19.8 inch by 20 inch) with 2 projectors