Advanced 3D Solder Paste Inspection System
V310i Advanced 3D Solder Paste Inspection System (SPI) solution.
The V310i Series offers a powerful range of technologies and high throughput productivity & traceability for SMT production lines.
4 MPxl digital camera; 18µm/pixel (Opt 10µm/pixel for 01005 inspection)
Field of view
36mm x 36 mm@18µm, 20mm x 20 mm@10µm
PSLM Structured Lighting, 2X Projectors (Optional 3X Projectors)
To learn more about the V310i and its highlights, simply download our datasheet below.
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|Maximum board size (Single Lane)||-|
|Maximum board size||510 mm by 510 mm (20 inch by 20 inch) with 2 projectors|
|Minimum board size||50 mm by 50 mm (2 inch by 2 inch)|
|Maximum board thickness||4 mm (0.16 inch)|
|Minimum board thickness||0.5 mm (0.02 inch)|
|Board weight||Up to 3kg (6.6lb)|
|Maximum inspected area||503 mm by 510 mm (19.8 inch by 20 inch) with 2 projectors|