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3D Solder Paste Inspection (SPI)

Built upon latest 3D projection technology, the TR7007QI SPI offers industry leading inspection accuracy for the most demanding applications. The inline inspection system automatically optimizes the inspection route for best performance, and TRI’s innovative SmartWarp system compensates for any board warpage during inspection. With a choice of quad/dual projector inspection, the TR7007QI is a versatile SPI solution bringing accuracy and speed to your fingertips.

Featured
Shadow-free Quad/Dual Digital Fringe projectors
Optimized Stop-and-Go Design for Maximum Accuracy
SmartWarp Compensation Eliminates Local PCB Deformation
100% Solder Paste Defect Coverage including Low Bridges

To learn more about the TRI TR7007QI 3D Solder Paste Inspection and its highlights, simply download our datasheet below.

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Optical System
Imaging Method Stop-and-Go Imaging
Camera 4 Mpix or 12 Mpix (factory setting)
Imaging Resolution 6 μm, 10 μm , 15 µm (factory setting)
Lighting RGB True Color LED
3D Technology 4-way Digital Fringe Pattern
Field of View 4 Mpix@ 10 µm: 20.3 x 20.3 mm

4 Mpix@ 15 µm: 30.5 x 30.5 mm

12 Mpix@ 6 µm: 24.4 x 18.4 mm*

12 Mpix@ 10 µm: 40.8 x 30.7 mm

12 Mpix@ 15 µm: 61.2 x 46.1 mm

* 6 μm is not available for TR7007QI DL

Inspection Performance
Imaging Speed 4 Mpix: 3 FOV/sec

12 Mpix: 2 FOV/sec

12 Mpix CoaXPress: 3 FOV/sec*

Note: Inspection speed depends on PCB and inspection conditions * With optional CoaXPress upgrade

Height Resolution @ 6 µm: 0.22 µm

@ 10/15 µm: 0.4 µm

Max. Solder Height @ 6 µm: 210/420 µm

@ 10/15 µm: 420/840 µm

Board Handling
Max PCB Size TR70007QI: 510 x 460 mm*

TR7007QI DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane

* 6 μm is only available for TR7007QI, the Max. PCB size is 330 x 310 mm

PCB Thickness 0.6-5 m
Max PCB Weight 3 kg