3D Solder Paste Inspection (SPI)
With industry leading speeds of up to 200 cm2/sec, the TR7007 SII Plus is the perfect SPI solution for any production line. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision, reliable linear motor platform, the system’s hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. TRI’s quick and intuitive user interface makes programming simple and easy, bringing maximum value to your production.
Industry leading inspection speed up to 200 cm2/sec @ 15 µm
Shadow free Fringe Pattern lighting technology
Optical resolution 10 µm or 15 µm
Linear motor design for stable and accurate inspection
Advanced SPC functions for production quality monitoring and evaluation
To learn more about the TRI TR7007 SII Plus SPI and its highlights, simply download our datasheet below.
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|Imaging Method||Dynamic Imaging|
|Imaging Resolution||10 µm or 15 µm (factory setting)|
|3D Technology||2-way Digital Fringe Pattern|
|Field of View||4 Mpix@ 10 µm: 20 x 20 mm
4 Mpix@ 15 µm: 30 x 30 mm
|Imaging Speed||4 Mpix@ 10 µm: 90 cm²/sec
4 Mpix@ 15 µm: 200 cm²/sec
|Height Resolution||0.4 µm|
|Max. Solder Height||@ 10 µm: 420 µm
@ 15 µm: 385 µm
|Max PCB Size||TR7007 SII Plus: 510 x 460 mm
TR7007L SII Plus: 660 x 610 mm
TR7007 SII Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane