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3D Solder Paste Inspection (SPI)

With industry leading speeds of up to 200 cm2/sec, the TR7007 SII Plus is the perfect SPI solution for any production line. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision, reliable linear motor platform, the system’s hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. TRI’s quick and intuitive user interface makes programming simple and easy, bringing maximum value to your production.

Featured
Industry leading inspection speed up to 200 cm2/sec @ 15 µm
Shadow free Fringe Pattern lighting technology
Optical resolution 10 µm or 15 µm
Linear motor design for stable and accurate inspection
Advanced SPC functions for production quality monitoring and evaluation

To learn more about the TRI TR7007 SII Plus SPI and its highlights, simply download our datasheet below.

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Optical System
Imaging Method Dynamic Imaging
Camera 4 Mpix
Imaging Resolution 10 µm or 15 µm (factory setting)
Lighting RGB LED
3D Technology 2-way Digital Fringe Pattern
Field of View 4 Mpix@ 10 µm: 20 x 20 mm

4 Mpix@ 15 µm: 30 x 30 mm

Inspection Performance
Imaging Speed 4 Mpix@ 10 µm: 90 cm²/sec

4 Mpix@ 15 µm: 200 cm²/sec

Height Resolution 0.4 µm
Max. Solder Height @ 10 µm: 420 µm

@ 15 µm: 385 µm

Board Handling
Max PCB Size TR7007 SII Plus: 510 x 460 mm

TR7007L SII Plus: 660 x 610 mm

TR7007 SII Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane

0.6-5 mm