Automated X-ray Inspection

TR7600XM SII and TR7600XLL SII are high performance and high speed 3D AXI for the largest server, networking and power PCBs. The TR7600XM SII and TR7600XLL SII systems use TRI’s unique shadow-free technology to inspect multi-layer boards with 2/3-layer PoPs, µBGAs, QFNs and Press-fit connectors. Smart programming assistants and multi-resolution programs help maximize production yields on any production line.

Very Large board edge to edge inspection up to 1000 mm x 660 mm
Automated programming saves hours of engineer workload
Multi resolution programs and advanced processing for superior image quality
Automatic 2D + 3D slice image extraction using Digital Tomosynthesis
X-ray tube with adjustable output up to 130 kV/300 µA

To learn more about the TRI TR7600XM/LL SII Automated X-ray Inspection and its highlights, simply download our datasheet below.

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Imaging System
Camera High-performance, ultra-sensitive bidirectional line-scan cameras
X-ray Source Microfocus tube 130 kV max (user adjustable)
Imaging Resolution 7 μm, 10 μm, 15 μm, 20 μm (3 settings factory configured)
Inspection Method 2.5D, 3D Slicing, Planar CT (optional)
Board Handling
Max PCB Size TR7600XM SII: 700 x 350 mm

TR7600XLL SII: 1000 x 660 mm

PCB Thickness TR7600XM SII: 0.6-5 mm

TR7600XLL SII: 0.6-7 mm

Max PCB Weight TR7600XM SII: 3 kg [8 kg optional]

TR7600XLL SII: 12 kg [15 kg optional]

Top Clearance @ 20 μm: 50 mm

@ 15 μm: 30 mm

@ 10 μm: 15 mm

@ 7 μm: 7 mm

Bottom Clearance 70 mm
Conveyor Height 880 - 920 mm * SMEMA Compatible