Automated X-ray Inspection

TR7600XLL SII CT is high performance and high speed 3D AXI for the largest server, networking and power PCBs. The TR7600XLL SII system uses TRI’s unique shadow-free technology to inspect multi-layer boards with 2/3-layer PoPs, µBGAs, QFNs and Press-fit connectors. Smart programming assistants and multi-resolution programs help maximize production yields on any production line. TRI’s Planar CT technology brings true 3D solder joint review for maximum inspection accuracy.

Very Large board edge to edge inspection up to 1000 mm x 660 mm
Automated programming saves hours of engineer workload
Multi resolution programs and advanced processing for superior image quality
Automatic 2D + 3D slice image extraction using Digital Tomosynthesis
X-ray tube with adjustable output up to 130 kV/300 µA
Planar CT Imaging for True 3D Solder Review

To learn more about the TRI TR7600XLL SII CT Automated X-ray Inspection and its highlights, simply download our datasheet below.

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Imaging System
Camera High-performance, ultra-sensitive bidirectional line-scan cameras
X-ray Source Microfocus tube 130 kV max (user adjustable)
Imaging Resolution 7 μm, 10 μm, 15 μm, 20 μm (3 settings factory configured)
Inspection Method 2.5D, 3D Slicing, Planar CT
Board Handling
Max PCB Size 1000 x 660 mm
PCB Thickness 0.6 - 7 mm
Max PCB Weight 12 kg
Top Clearance @ 20 μm: 50 mm

@ 15 μm: 30 mm

@ 10 μm: 15 mm

@ 7 μm: 7 mm

Bottom Clearance 70 mm
Edge Clearance 3 mm [5 mm optional]