Automated X-ray Inspection

Built for maximum inspection performance, TR7600X SII series offers ultimate performance 3D X-ray inspection for the largest server, networking and power PCBs. With advanced ultra-high-speed cameras, the TR7600X SII series combines TRI’s unique shadow-free 3D inspection of multi-layer boards with 2/3-layer PoPs, µBGAs, QFNs, Press-fit connectors with fully automated programming and multi-resolution programs help maximize production yields on any production line.

Ultra-high-speed bidirectional cameras
Large board edge to edge inspection up to 900 mm x 460 mm
X-ray tube with adjustable output up to 130 kV/300 µA
Multi resolution BlockScan programs and advanced processing for superior image quality
Automatic 2D + 3D slice image extraction using Digital Tomosynthesis
Exclusive Image enhancement technology for clear Pressfit inspection

To learn more about the TR7700QE and its highlights, simply download our datasheet below.

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Imaging System
Camera High-performance, ultra-sensitive bidirectional line-scan cameras
X-ray Source Microfocus tube 130 kV max (user adjustable)
Imaging Resolution 10 μm, 15 μm, 20 μm (factory setting)
Inspection Method 2.5D, 3D Slicing, Planar CT (optional)
Board Handling
Max PCB Size 900 x 460 mm
PCB Thickness 0.6-5 mm
Max PCB Weight 3 kg [8 kg optional]
Top Clearance @ 20 μm: 50 mm

@ 15 μm: 30 mm

@ 10 μm: 15 mm

Bottom Clearance 40 mm
Edge Clearance 3 mm
Conveyor Height 880 - 920 mm

* SMEMA Compatible