Automated X-ray Inspection

TR7600F2D is a high performance inline 2.5D AXI specialized for single layer PCB and FPCB assemblies requiring highest image quality. Ideal for mobile electronics applications, the TR7600F2D can reliably detect microscopic voids, 01005 solder defects, and many QFN and BGA problems. Combining a fully automated programming and multi-resolution programs help maximize production yields on any production line.

Ultra-high-resolution edge to edge inspection up to 900 mm x 460 mm
Automated programming saves hours of engineer workload
Multi resolution programs and advanced processing for superior image quality
2D and off-axis imaging for shadow-free inspection
X-ray tube with adjustable output up to 130 kV/300 µA

To learn more about the TRI TR7600F2D Automated X-ray Inspection and its highlights, simply download our datasheet below.

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Imaging System
Camera High resolution flat panel camera
X-ray Source Microfocus tube 130 kV max (user adjustable)
Imaging Resolution 5 μm, 10 μm, 15 μm (factory setting)
Inspection Method 2D, 2.5D, Planar CT (optional)
Board Handling
Max PCB Size 900 x 460 mm
PCB Thickness 0.6-5 mm
Max PCB Weight 3 kg [8 kg optional]
Top Clearance @ 15 μm: 30 mm

@ 10 μm: 20 mm

@ 5 μm: 10 mm