Automated Optical Inspection (AOI)

TRI’s optimum 3D AOI solution delivers the fastest multi-angle PCB inspection coupled with blue-laser-based true 3D profile measurement for the highest automated optical defect symptoms coverage possible. Combining state-of-the-art software solution and third generation intelligent hardware platform, the TR7500 SIII 3D offers robust 3D solder and component defect inspection and with high inspection coverage and easy programming.

High Speed Color Multi-angle Inspection of Up to 01005 Components
High Defect Coverage Using Hybrid 2D+3D Inspection Technology
True 3D Profile Measurement Using Dual Laser Units
Rapid Programming Interface with Auto Library and Offline Editing

To learn more about the TR7500 SIII 3D and its highlights, simply download our datasheet below.

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Optical System
Imaging Method Dynamic Imaging with true 3D profile measurement
Top Camera 4 Mpix
Angle Camera 1.3 Mpix or 6.5 Mpix (factory setting)
Imaging Resolution Optical: 10 µm, 15 µm Laser: 10 μm (optional), 20 μm, 50 μm Note: Factory setting
Lighting Multi-phase RGB+W LED
3D Technology Single/Dual 3D laser sensors
Max. 3D Range 20 mm

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Inspection Performance
Imaging Speed 4 Mpix@ 10 µm 2D: 60 cm²/sec

4 Mpix@ 15 µm 2D: 120 cm²/sec

4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*

4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*

* Depending on board size and laser resolution

Motion Table & Control
X-Axis Control Ballscrew + AC-servo controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control N/A
X-Y Axis Resolution 1 µm

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WxDxH TR7500 SIII 3D: 1100 x 1670 x 1550 mm

TR7500L SIII 3D: 1300 x 1630 x 1655 mm

TR7500 SIII 3D DL: 1100 x 1770 x 1550 mm

Note: not including signal tower, signal tower height 520 mm

Weight TR7500 SIII 3D: 1010 kg

TR7500L SIII 3D: 1250 kg

TR7500 SIII 3D DL: 1150 kg