Menu

Professional SMD Rework Station

The IR-D3 Discovery rework system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield SMD rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.

The IR-D3 can be easily configured to your requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4500 customers.

Advanced Focused IR component heating
150W, lens based Focused IR heating with adjustable image system

Quartz IR PCB preheating
2000W, two zone (240mm x 240mm heating area)

Precision Component Pick and Placement
Professional vacuum placement system

Component Nest/Flux Application Facility
Optional Jaw mounted nest with flux dip tray or component print frame

Precision PCB Handling
Professional PCB table with micro X/Y

Component Temperature Sensing
Standard non-contact IR temperature sensor

PCB Temperature Sensing
K-type wire thermocouple
Optional non-contact IR temperature sensor

Advanced Thermal Process Control
Software based auto profile thermal control

Camera/Prism Based BGA/CSP/QFN
Alignment System (Optional)
Auxiliary process observation camera

Auxiliary Process Camera (Optional)
Auxiliary process observation camera

To learn more about the IR-D3 Discovery and its highlights, simply download our datasheet below.

Contact our Production Support Specialist

Our sales and technical team are on hand to support any questions you may have.

Swipe for more

Top heat power 150W IR
Back heater power 1600W or 2000W IR
Voltage/frequency 208-240 volts 50/60Hz, up to 3KW
Typical components CSPs, BGAs, uBGAs, QFNs, QFPs, PLCCs, SOICs, small SMDs
Bench area 1400mm (w) x 600mm (d)
Weight 65 Kg